Meridian MI0801 Camera Module
High-Definition, Cost-Effective and Compact Thermal Imaging Camera Module Powered by SenXorTM, Meridian Innovation’s patented innovative CMOS hybrid architecture, MI0801 Camera Module is a Wafer Level Vacuum Packaged (WLVP) 80 x 62 Long
Wavelength Infrared (LWIR) thermal array sensor from Meridian
Innovation mounted in a custom housing.
The MI0801 chip comprises of two CMOS wafers bonded together with a vacuum cavity in between. The base (active) wafer contains all the circuit and sensor elements; the top (cap) wafer is required to transfer the LWIR radiation and maintain a vacuum environment for optimum operation of the LWIR detectors.
The MI0801 Camera Module comprises of WLVP chip, die attached to a PCB substrate and mounted in a custom housing, including lens assembly. It is designed to connect to Meridian Innovation’s MI48A0 Thermal Image Processor Board via a simple flat strip cable. In this way multiple processing subsystems can be supported. The housing allows for the fitment of various lens assemblies, allowing fast adaptation within several application areas.
Part no.: MI0801M0G
Key features
- Resolution 80 (H) x 62 (V)
- IR Wavelength 8 - 14μm (Thermal LWIR)
- Temperature accuracy up to +-1°C
- Interface USB
- Data capture from standby Less than TBD ms
- TSP Processing Non-uniformity, Environmental temperature, voltage correction
- Performs temporal and/or spatial filtering of thermal data
- Power Consumption Less than TBD mW
- Calibration Shutter-less, factory pre-calibrated
- ITAR No control and export compliance at 30Hz
Applications
- IoT
- Thermal Imaging
