Key features

  • Extremely low-power performance
  • Designed to support Bluetooth LE Audio use cases
  • Bluetooth 5.3 radio
  • Ultra-small form factor
  • Powerful tri-core processor architecture – supporting complex use cases
  • Dual core 32-bit processor application subsystem (up to 80MHz)
  • Single core 180 Mhz configurable Qualcomm® Kalimba™ DSP audio subsystem (runs from ROM)
  • Qualcomm TrueWireless™ Mirroring technology for improved robustness and a superior user experience
  • Designed to support button activated digital assistants including Amazon Alexa Voice Service and Google Assistant
  • Support for Google Fast Pair
  • Software architecture compatible with Qualcomm® QCC302x, Qualcomm® QCC304x, Qualcomm® QCC304x and Qualcomm® QCC305x series
  • Embedded ROM + RAM and external Q-SPI Flash
  • On-chip memory for audio buffering
  • High-performance audio combined with low-power consumption
  • Support for aptX Voice superior for call quality on uplink and downlink
  • Support for 24bit/96kHz high resolution audio
  • Support for aptX Audio including aptX Adaptive cVc
  • 24-bit audio interfaces
  • Support for Qualcomm Hybrid ANC - feedforward, feedback, hybrid and adaptive


  • Smart Home
  • Consumer Electronics

Qualcomm wireless module QCC3072 bluetooth audio

Qualcomm wireless module QCC3072 bluetooth audio

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